April 26th, 2018

Techinvent 2K18 at Chandigarh University.

Giving students an opportunity to explore their minds and put their innovative ideas into reality, Civil Engineering Department and Electronics and Communication Engineering Department at CPC, Organized events : Beat O Bond and Funk from Junk at TechInvent 2K18 on 26th March’18.

In Beat O Bond, the participants were required to make a brick walls of given room given in drawing without mortar with brick bond on the spot. In Funk from Junk, the participants were required to make something useful from wastage. The students participated actively and showed a variety of creativity and innovation.